Scope

Area 1 Advanced CMOS: Material Fundamentals / Process Science / Device Physics

Chair : H. Morioka (Socionext Inc.)

Papers related to device and material technologies for CMOS and relevant transistors are solicited including the following:

(1) Advanced CMOS devices with improved performance, ultralow power, subthreshold-slope steepening, 3D scaling, etc.;
(2) Emerging material and LSI process technologies for high-mobility channels, junctions/contacts, MOS interfaces, 3D nanostructures, and heterogeneous integration for devices with high performance and new functions;
(3) Fundamental physics, theoretical simulation, and modeling for emerging transistor technologies including material, process, and device engineering;
(4) Design technology co-optimization for improving device performance, manufacturability, reliability, and yield.

Area 2 Advanced and Emerging Memories / New Applications

Chair : K. Yamamoto (KIOXIA Corp.)

Papers related to advanced memory technologies are solicited including the following:

(1) Conventional memories and novel memories such as ReRAM, MRAM, PRAM, and FeRAM;
(2) Memory-function-related circuit elements;
(3) Memory device physics, reliability, and modeling;
(4) Cell structures, processes, and materials;
(5) Devices for neuromorphic computing applications, and memory-based logic applications.

Area 3 Interconnect / 3D Integrations / MEMS

Chair : K. Shiojima (Univ. of Fukui)

Papers related to interconnect materials, processes, and devices are solicited including the following:

(1) Interconnect structures, low-power devices, high-reliability devices, Cu/low-k, barriers, carbon-based interconnects, new materials and processes;
(2) 3D integration and packaging technologies, including TSVs, bumps, bonding, stacking methods, stress and thermal analysis, etc.;
(3) MEMS/RF, MEMS integration, and bio-MEMS;
(4) Heterogeneous 3D systems-in-packages;
(5) Fabrication technology for optical interconnects;
(6) Theoretical and simulation technology for reliable interconnects.

Area 4 Power / High-speed Devices and Materials

Chair : K. Tsuda (Toshiba Infrastructure Systems & Solutions Corp.)

Papers related to power devices (Si, SiC, GaN, Ga₂O₃, diamond, and other materials) and high-speed compound semiconductor devices (FETs, HFETs, HEMTs, HBTs, and other novel devices) are solicited including topics on the following:

(1) Materials and physical properties;
(2) Processes and characterization;
(3) Device physics;
(4) Reliability and modeling;
(5) Interconnect, packaging, and module technologies;
(6) Novel applications.

Area 5 Photonics: Devices / Integration / Related Technology

Chair : F. Boeuf (STMicroelectronics)

Papers related to photonic technologies and physics are solicited including the following:

(1) Photonic/optoelectronic integration such as Si photonics, hybrid photonics, and photonic/electronic convergence circuits;
(2) LEDs (including III-nitride, organic/inorganic, and novel materials), lasers, photodetectors, optical modulators, optical amplifiers, optical isolators, optical waveguides, wavelength filters, and other photonic devices;
(3) Implementation and packaging for optical communication systems and LED lighting;
(4) Photonic devices and circuits for optical interconnects;
(5) Optical signal processing;
(6) Optical sensing technologies for living bodies, in-vehicle use, and others;
(7) Photonic materials and process technologies;
(8) Device physics;
(9) Novel optical phenomena and applications;
(10) Integrated optical circuits for quantum applications;
(11) Applications of integrated optics to AI.

Area 6 Photovoltaic / Energy Harvesting / Battery-related Technology

Chair : M. Ikegami (Toin Univ. of Yokohama)

Papers related to experimental and theoretical studies of solar cells, solid-state rechargeable batteries, capacitors, and other ambient energy harvesters including rectennas, solid oxide fuel cells, piezoelectric generators, thermoelectric generators, etc. The scope of this area includes the following:

(1) Novel materials for energy generation/conversion/storage systems including superionic conductors;
(2) Processes, characterizations, and physical properties of solid-state materials and devices for energy generation/conversion/storage systems including superionic conductors;
(3) Device physics and numerical simulation/modeling;
(4) Cathode/anode/electrolyte developments for electrochemical energy storage devices (batteries, capacitors);
(5) Module technologies, including encapsulation and interconnections.

Area 7 Organic / Molecular / Bio-electronics

Chair : H. Okada (Univ. of Toyama)

The scope of this area includes devices fabricated using organic or molecular materials, or studies dealing with biological, chemical, or medical applications. Papers related to the following list are solicited, including peripheral areas.

(1) Organic and molecular electronics and related phenomena;
(2) Organic transistors and light-emitting devices;
(3) Organic-based photovoltaics;
(4) Physical and chemical sensors, memories, and actuators;
(5) Biological materials and related phenomena;
(6) Imaging and spectroscopy systems;
(7) Biosensors and medical sensors;
(8) Bio-MEMS/NEMS, CMOS, and related devices;
(9) µ-TAS and labs on chips (LOCs);
(10) Liquid crystal materials and devices.

Area 8 Low Dimensional Devices and Materials

Chair : K. Nagashio (Univ. of Tokyo)

Papers related to low-dimensional materials such as quantum dots, nanowires, nanotubes, graphene, and 2D materials, and their device applications are solicited. The scope includes both experimental and theoretical studies on the following:

(1) Growth and characterization;
(2) Fundamental physics;
(3) Electronic and optical devices;
(4) Sensors;
(5) Interconnects;
(6) Energy harvesting;
(7) Nano-mechanics;
(8) Novel functional devices.

Area 9 Novel Functional / Quantum / Spintronic Devices and Materials

Chair : T. Ono (Kyoto Univ.)

Papers related to new physics and its applications in novel functional/quantum/spintronic devices and materials are solicited, including topics the following:

(1) Quantum-mechanical phenomena and nanodevices studied utilizing single electrons, excitons, photons, plasmons, and other quanta;
(2) Spin transport and spintronic devices;
(3) Spin-related interactions with light and high-frequency electromagnetic waves;
(4) Emerging material systems such as topological insulators, graphene, diamond NV centers, and 2D materials;
(5) Emerging device systems for neuromorphic computing or neuroscience.

Area 10 Thin Film Electronics: Oxide / Non-single Crystalline / Novel Process

Chair : M. Furuta (Kochi Univ. of Tech.)

Papers are solicited on technical innovations relating to thin-film materials, processing, and manufacturing technologies covering

(1) Oxide and non-single-crystalline materials for thin-film electronics including amorphous, nanosize, low-dimensional, microcrystalline, and polycrystalline materials;
(2) Homogeneous and compound thin-film material synthesis, growth, and other process technologies including deposition, crystallization, layer transfer, liquid processes, and novel approaches;
(3) Device fabrication, characterization, reliability, modeling, flexible devices, and their applications.

Area 11 Advanced Materials: Synthesis / Crystal Growth / Characterization

Chair : H. Tatsuoka (Shizuoka Univ.)

Papers related to advanced material synthesis, crystal growth, and characterization technologies are solicited, including semiconductor- and functional-material-based advanced technologies of

(1) Crystal growth;
(2) Synthesis;
(3) Fabrication;
(4) Doping;
(5) Nanostructures;

Area 12 Advanced Circuits / Systems Interacting with Innovative Devices and Materials

Chair : K. Johguchi (Shinshu Univ.)

Papers related to circuits and systems based on solid-state devices and materials are solicited, including:

(1) Sensor-related circuits, systems, and applications;
(2) Imagers based on photonic devices and circuit techniques;
(3) Biomedical circuits and systems;
(4) Power electronics circuits and systems including drivers, power converters, and wireless power transfer systems;
(5) Neuroscience, AI, edge computing for IoT;
(6) Memory-related circuit and system techniques including readout/write circuits and high-speed I/Os;
(7) RF building blocks and transceivers;
(8) Analog/digital/mixed-signal circuit techniques for building blocks;
(9) Ultralow-power systems and energy-harvesting circuit techniques;
(10) Circuit design methodologies and test/measurement techniques;
(11) Other circuits and systems using new devices and materials: MEMS, flexible electronics.

In 2020, “Circuit and package co-design for smart systems” and “Innovative-device-based circuits and systems for 5G and beyond” will be covered as the topical sessions. Regular circuit/system- and application-oriented papers including, but not limited to, such topics are welcome and we strongly recommend their submission in this area.