Invited Speakers
Area 1
Advanced CMOS: Material Science / Process Engineering / Device Technology
Area 2
Advanced and Emerging Memories / New Applications
-
Bandgap-Engineered Gate Stack Using BN-Based Dielectric for 3D V-NAND Flash Memory
Dae Hyun Kang
KAIST, Korea
-
Analysis of OTS Switching Mechanisms and Memory Characteristics via DFT-informed Stochastically Induced Defect Percolation Model
Hyunsang Hwang
POSTECH, Korea
-
TBA
Sheng-Yu Peng
National Yang-Ming Univ. of National Chiao Tung, China
-
TBA
Hiroshi Funakubo
Tokyo Inst. of Technology, Japan
-
TBA
Vijaykrishnan Narayanan
The Pennsylvania State Univ., USA
-
TBA
Masahiko Nakayama
Kioxia Corp., Japan
-
TBA
Mutsumi Okajima
Kioxia Corp., Japan
-
TBA
Yung-Hsien Wu
National Tsing Hua Univ., Taiwan
-
MRAM based probabilistic computing
Hyunsoo Yang
National Univ. of Singapore, Singapore
-
TBA
Michael Hoffmann
Ferroelectric Memory Company, USA
Area 3
Heterogeneous and 3D Integration / Interconnect / MEMS
Area 4
Power / High‐speed Devices and Materials
Area 5
Photonics: Devices / Integration / Related Technology
Area 6
Energy Harvesting and Converting Devices and Materials
Area 7
Organic / Molecular / Bio‐electronics
Area 8
Low Dimensional Devices and Materials
Area 10
Thin Film Electronics: Oxide / Non‐single Crystalline / Novel Process
Area 11
Advanced Materials: Synthesis / Crystal Growth / Characterization
Area 12
Advanced and Innovative Circuits / Systems Interacting with Devices and Materials