Short Courses

Tuesday, September 5, 2023
[Short Course A] Leading-edge CMOS Technology for 2nm-node and beyond (Room F (224), Bldg. 2) [Short Course B] Plasma technology: Cornerstone of the post-scaling and next milestone of assurance energy and environment (Room K (234), Bldg. 2)

A Leading-edge CMOS Technology for 2nm-node and beyond

Organizer:
Meishoku Masahara (AIST)
Meishoku Masahara (AIST)
Chair:
Toshifumi Irisawa (AIST)

  • Yuzo Fukuzaki (Synopsys)
    13:00 – 13:45
    “Logic Scaling Trend”
    Yuzo Fukuzaki
    (Rapidus US, Formerly with TechInsights)
  • Makoto Ikeda (Univ. of Tokyo)
    13:45 – 14:30
    “Chip Design Democratization for Scaled CMOS”
    Makoto Ikeda
    (Univ. of Tokyo)
  • Seiji Nagahara (Tokyo Electron Ltd.)
    14:30 – 15:15
    “Advanced Technologies for Extending EUV Lithography”
    Seiji Nagahara
    (Tokyo Electron Ltd.)
  • 15:15 – 15:30
    Break (15 min)
  • Fumihiro Inoue (Yokohama National Univ.)
    15:30 – 16:15
    “Fundamental Insights into Advanced Processes of 3D Integration”
    Fumihiro Inoue
    (Yokohama National Univ.)
  • Hitoshi Wakabayashi (Tokyo Tech)
    16:15 – 17:00
    “2D FETs with TMDC films for CFET and 3DI Transistors”
    Hitoshi Wakabayashi
    (Tokyo Tech)
  • Tatsuro Maeda (AIST)
    17:00 – 17:45
    “Complimentary FET process technology towards functional scaling”
    Tatsuro Maeda
    (AIST)

B Plasma technology: Cornerstone of the post-scaling and next milestone of assurance energy and environment

Organizer:
Kenji Ishikawa (Nagoya Univ.)
Kenji Ishikawa (Nagoya Univ.) Chair:
Masanori Terahara (Western Digital Corp.)

  • Andreas Mai (IHP)
    13:00 – 13:45
    “CMOS+X for functional diversification of post-scaling microelectronics”
    Andreas Mai
    (IHP)
  • Naoto Horiguchi (imec)
    13:45 – 14:30
    “Sustainable CMOS Scaling in Nanosheet Era”
    Naoto Horiguchi
    (imec)
  • Masaru Izawa (Hitachi High-Tech Corp.)
    14:30 – 15:15
    “Dry Etching Technology for Logic Device”
    Masaru Izawa
    (Hitachi High-Tech Corp.)
  • 15:15 – 15:30
    Break (15 min)
  • Akihiro Tsuji (Tokyo Electron Miyagi Ltd.)
    15:30 – 16:15
    “Technological direction of high aspect ratio etching for memory devices”
    Akihiro Tsuji
    (Tokyo Electron Ltd.)
  • Yasuhiro Morikawa (ULVAC, Inc.)
    16:15 – 17:00
    “Prospect of dry etching technology for 3D･Chiplet integration”
    Yasuhiro Morikawa
    (ULVAC, Inc.)