2014 International Conference on Solid State Devices and Materials (SSDM2014) will provide an excellent opportunity for firms, companies and other organizations in fields related to solid state devices and related materials to showcase and demonstrate their expertise, products and services to both the local and the international conference participants.
The price of Exhibitors Package is : 200,000 Japanese yen
This Package includes:
Exhibition booths are located in the central part of the conference hall, either on the ground floor close to the entrance or along the corridor on the 2nd floor which connects major session rooms. The booth location ensures the best possible exposure of the exhibits to the conference participants. For the detailed floor plan, please refer to the second last page of the Sponsor Guideline, which can be downloaded from the link on the right hand side. Any questions on the exhibition is welcome via the e-mail address shown on the right hand side.