Sponsored by: THE JAPAN SOCIETY OF APPLIED PHYSICS
Thechnical-Cosponsered by: IEEE Electron Devices Society
in cooperation with (Tentative:) The Electrochemical Society of Japan IEEE EDS Japan Chapter IEEE Japan Council The Institute of Electrical Engineers of Japan The Institute of Electronics, Information and Communication Engineers The Institute of Image Information and Television Engineers Japan Institute of Electronics Packaging Marubun Research Promotion Foundation
