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STRATEGIC AREAS |
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| [10] Non-Volatile
Memory Technologies |
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(Chair, K. Takasaki,
Fujitsu Lab.) |
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"Non-volatile
Memories" session solicits all NV memory (Flash, FeRAM, EPROM, EEPROM,
Anti-fuse, MRAM & others) technology related papers. Topics relating
to NV devices include cell device physics & characterization, processing
& materials, tunnel dielectrics, ferroelectric materials, reliability,
failure analysis, quality assurance & testing, modeling & simulation,
integrated circuits, new concept technologies, and new applications &
systems (solid state disks, memory cards, programmable logic,-). |
| |
| [11] SiGe/III-V/III-N
Devices and Circuits for Wireless and Optical Communications |
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(Chair, T. Enoki,
NTT) |
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Compound-semiconductor
devices are playing important roles in wireless and optical communications
systems. Future communications systems definitely require devices and circuits
that dissipate lower energy, operate at higher bit rates or frequencies,
have lower noise, generate higher signal power, and are more compact. This
session covers advanced device and IC technologies that meet these challenges
through the use of SiGe, GaAs-based, InP-based, and N-based materials (but
not limited). Monolithic ICs or multi-chip modules integrating optical and
electrical devices will also be discussed. Papers demonstrating breakthroughs
and novel concepts, discussing on potentials and limitations, and addressing
issues in these technologies are strongly solicited for this session. |
| |
| [12] System-Level
Integration and Packaging Technologies |
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(Chair, K. Takahashi,
ASET) |
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The scope of this subcommittee
involves all features of advanced packaging technologies and system-level
integration technologies based on packaging technology. Papers are solicited
in, but not limited to, the following areas: (1) Advanced packaging technologies
including chip size package (CSP), wafer-level package, stacked package,
(2) Three-dimensional (3D) integration technology including wafer stacking
and chip stacking, (3) System integration technologies including SiP (system-in-package),
SoP (system-on-package), opto-electronics integration and MEMS, (4) Design
and CAD technologies for the advanced packaging and system integration including
interface design, EMI and EMC management and ultra-high speed data transfer
technologies, (5) Testing technologies for the system integration including
burn-in, known good die (KDG) and design for test (DFT), (6) Modeling and
simulation of thermal, mechanical and electrical performance of advanced
packaging and system integration. |
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| [13] Organic
Semiconductor Devices and Materials |
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(Chair, M. Iwamoto,
Tokyo Institute of Technology) |
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Electronic and Optical
processes in organic materials and device application in the following fields
(but not limited): (1) Organic transistors, diodes and circuits (2) Organic
light emitting devices (3) Organic photodetectors and photovoltaic devices
(4) Chemical sensors and gas sensors (5) Fabrication and characterization
of organic thin films (6) Electrical and Optical properties of organic thin
film and materials (7) Organic-inorganic hybrid systems (8) Interfacial
phenomena, LC devices, etc. |
| |
| [14] Micro-Nano
Electromechanical Devices for Bio- and Chemical Applications |
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(Chair, Y. Miyahara,
National Institute for Materials Science) |
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Micro/nano electromechanical
devices (M/NEMS) are now widely applied to biochemical, medical and environmental
fields and a new research field called μ-TAS or Lab. on a Chip is expanding
and being established. Fusion of microelectronic devices with materials
and methods in the chemical, biological, and mediacl fields is expected
to open up new scientific and business fields. Papers are solicited in the
following areas (but not limited): (1) Micro/nano electronic mechanical
system (M/NEMS) for RF, optical, power and others, (2) μ-TAS and Lab
on a chip, (3) Various Bio-chips for DNA, healthcare and proteins, (4) Fabrication
technologies and (5) New integrated micro/nano systems for biochemical and
medical applications. |
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