Non-Volatile Memory Technologies
"Non-Volatile Memory Technologies" session solicits all NV memory (Flash, MONOS, FeRAM, MRAM, Phase Change, Nanocrystal, Anti-fuse, and others) technology related papers. Topics relating to NV devices include cell device physics and characterization, processing and materials, tunnel dielectrics, ferroelectric materials, reliability, failure analysis, quality assurance and testing, modeling and simulation, integrated circuits, new concept technologies, and new applications and systems (solid state disks, memory cards, programmable logic, etc.).
SiGe/III-V/III-N Devices and Circuits for Wireless and Optical Communications
Compound-semiconductor devices are playing important roles in wireless and optical communications systems. Future communications systems definitely require devices and circuits that dissipate lower energy, operate at higher bit rates or frequencies, have lower noise, generate higher signal power, and are more compact. This session covers advanced device and IC technologies that meet these challenges through the use of SiGe, GaAs-based, InPbased, and GaN-based materials (but not limited). Monolithic ICs or multi-chip modules integrating optical and electrical devices will also be discussed. Papers demonstrating breakthroughs and novel concepts, discussing on potentials and limitations, and addressing issues in these technologies are strongly solicited for this session.
System-Level Integration and Packaging Technologies
The scope of this subcommittee involves all features of advanced packaging technologies and system-level integration technologies based on packaging technology. Papers are solicited in, but not limited to, the following areas: (1) Advanced packaging technologies including chip size package (CSP), wafer-level package, stacked package, (2) Three-dimensional (3D) integration technology including wafer stacking and chip stacking, (3) Advanced interconnection technologies such as optical, wireless, capacitive and inductive interconnections, (4) System integration technologies including SiP (system-inpackage), SoP (system-on-package), opto-electronics and MEMS integration, (5) Modeling and simulation of thermal, mechanical and electrical performance of advanced packaging and system integration, (6) Design and CAD technologies for the advanced packaging and system integration including interface design, EMI and EMC management and ultra-high speed data transfer technologies, (7)Testing technologies for the system integration including burn-in, known good die (KDG) and design for test (DFT).
Organic Semiconductor Devices and Materials
Electronic and Optical processes in organic materials and device application in the following fields (but not limited): (1) Organic transistors, diodes and circuits, (2) Organic light emitting devices, (3) Organic photodetectors and photovoltaic devices, (4) Chemical sensors and gas sensors, (5) Fabrication and characterization of organic thin films, (6) Electrical and Optical properties of organic thin film and materials, (7) Organic-inorganic hybrid systems, (8) Molecular electronics, (9) Interfacial phenomena, LC devices, etc.
Micro/Nano Electromechanical Devices for Bio- and Chemical Applications
Micro/nano electromechanical devices (M/NEMS) are now widely applied to biochemical, medical and environmental fields and a new research field called microTAS or Lab. on a Chip is expanding and being established. Fusion of microelectronic devices with materials and methods in the chemical, biological, and medical fields is expected to open up new scientific and business fields. Papers are solicited in the following areas (but not limited): (1) Micro/nano electronic mechanical systems (M/NEMS) for RF, optical, power and others, (2) microTAS and Lab on a chip, (3) Various Bio-chips for DNA, healthcare and proteins, (4) Fabrication technologies and (5) New integrated micro/nano systems for biochemical and medical applications.
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